
Bishnu Pada Bose
Invosystems Solutions Pte Ltd
Singapore
Event Starts
ICTFEMA
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jun 21, 2026
ICTFEMA
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jun 21, 2026
The main purpose of International Conference on Thin Films Engineering and Materials Applications is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Start Date
Saturday, July 11, 2026
End Date
Sunday, July 12, 2026
Registration Deadline
Friday, June 26, 2026
Submission Deadline
Sunday, June 21, 2026
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
Meet the distinguished experts guiding the conference.

Invosystems Solutions Pte Ltd
Singapore

East West Institute of Technology
India

University of Belgrade
Your Place
Learn from renowned speakers and industry leaders.

PAN Health and Hygiene Private Limited

Zeal College of Engineering and research, Narhe, Pune

Indiana University
Ambassador Hotel
XQRQ+V75
Addis Ababa 1130
Ethiopia
Addis Ababa, Ethiopia
Engineering And Technology in Ethiopia
Gondar, Ethiopia
Dessie, Ethiopia
Bahir Dar, Ethiopia
Dire Dawa, Ethiopia
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